Cu-to-Cu hybrid bonding solves scalability issues with pitch reduction and enables a thinner package
As pitch sizes continue to reduce for higher I/O counts the functional limit of solder approaches. Cu-to-Cu hybrid bonding solves scalability issues with pitch reduction and enables a thinner package. At the same time performance increases are obtained including power reduction and min RLC (resistance-inductance-capacitance). Package interconnect reliability is also improved due to solder joint removal, improved thermal dissipation, improved mechanical strength and elimination of EM voiding. Hybrid bonding is an enabling solution for Die-to-Die(D2D), Die to wafer(D2W), wafer to wafer(W2W) applications.