(Waterbury, CT USA) – December 13, 2021 – MacDermid Alpha Electronics Solutions, will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.
Maddux Sy, Applications Manager for the Metallization group, will be presenting “ RDL and Pillar Fabrication from a Versatile Copper Plating Process“. The paper discusses the challenges fabricators face not only in meeting the copper plating performance requirements but also in reducing manufacturing process costs.
Interested participants can stop by booth K606 in Hall 1 to talk to our industry experts about the latest offerings from MacDermid Alpha. Featured in the booth will be the MacDermid Enthone brand of product offerings that enable the most complex printed circuit board and IC Substrate designs. Highlighted will be the entire Systek family of high performance build-up processes for IC Substrate RDL that provide multiple process flows for differet materials, Affinity 2.0, the new Affinity Gold 3.0 and the soon to be released Affinity Select, the OSP compatible selective ENIG process. Also featured will be the full portfolio of MacuSpec acid copper products that meet all applications, from ultra-aspect ratio conformal plating down to filling the smallest blind microvias.