The MacuSpec™ VF, AVF, and VF-TH series are production-proven processes that are specifically engineered to fill blind micro vias. The VF-TH series processes are also able to simultaneously plate through holes in the same bath.
- MacuSpec VF Series – General via filling in panel or pattern plating mode.
- MacuSpec AVF Series – Advanced via filling for Any Layer applications.
- MacuSpec VF-TH Series – Multifunctional processes for mSAP and SAP.
The MacuSpec VF, AVF, and VF-TH series are production-proven processes that are specifically engineered to fill blind micro vias. The VF-TH series processes are also able to simultaneously plate through holes in the same bath.
MacuSpec VF Brochure (EN)
Microvia Reliability Brochure (EN)
MacuSpec AVF 700 Sales Sheet (EN)
MacuSpec VF-TH 200 Sales Sheet (EN)
MacuSpec VF-TH 300 Sales Sheet (EN)
Acid Copper Electroplating Processes with Excellent V-Pit Resistance for Flash Etching Technical Publication APEX 2020 (EN)
Addressing the Changing Landscape of Automotive Electronic Designs Technical Publication APEX 2021 (EN)
Advanced Cu Electroplating Process For Any Layer Via Fill Applications With Thin Surface Copper Technical Publication APEX 2018 (EN)
Copper Electroplating Process for mSAP Resistant to Etch-Induced Pitting Technical Publication IMPACT 2020 (EN)
Copper Plating Process for Filling Micro Vias and Through via Holes with Minimum Surface Deposition Technical Publication EIPC 2013 (EN)
Electroplating Processes for IC Substrates - Embedded Trace Plate, Via Fill and Through Hole Fill Technical Publication IMPACT 2018 (EN)
Filling Characteristics Of Process For Electroplating Copper Into Microscopic Recessed Features Technical Publication SMTAI 2012 (EN)
Innovative Acid Copper Process For Simultaneously Filling Vias And Plating Through Holes Technical Publication HKPCA 2017 (EN)
Innovative Acid Copper Process For Simultaneously Filling Vias And Plating Through Holes Technical Publication SMTAI 2018 (EN)
Innovative Electroplating Processes for IC Substrates - Via Fill, Through Hole Fill, and Embedded Trench Fill Technical Publication PCB007 2019 (EN)
Pit Resistant Acid Copper Electroplating Process for Flash Etching Technical Publication SMTAI 2020 (EN)
Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution Technical Publication APEX 2018 (EN)
Systek Advance Packaging Brochure (EN)
MacuSpec VF Series
The MacuSpec VF Series via filling copper metallization solutions are the production proven standard for via filling in electronic devices used worldwide for over 20 years. With options that are applied to fit every application in the HDI market, the MacuSpec VF processes provide the most stable and consistent via filling available in the market today.
MacuSpec AVF Series
The MacuSpec AVF series are advanced via fill copper metallization processes for high density interconnects. The AVF technology allows for minimal surface copper under a wide variety of plating conditions. The unique formula of chemical components and equipment parameters enables customers to plate a broad range of blind micro via sizes in just one bath without the need of flash plate.
The filled micro vias created by AVF series baths have an extraordinary degree of repeatability while also adhering to IPC 6012D 188.8.131.52 standard.
MacuSpec VF-TH Series
The VF-TH Series are copper plating baths that can simultaneously fill copper micro vias and plate through holes with aspect ratios of up to 5:1 on a wide range of structure sizes with great physical properties.
MacuSpec VF-TH technology reduces the number of processing steps without a reduction in reliability. The MacuSpec VF-TH 300 process also eliminates post plating annealing by plating a deposit that is resistant to V-pitting during etching. The copper deposited from the VF-TH Series baths has superior physical properties, passing IPC 6012D, DS, and 6013D standards. These standards require tensile strength to be no less than 40,000 PSI and elongation to be no less than 18%.