Sintering Die Top Attach

The reliability testing on previous generation power devices demonstrated that the two main causes of failure are die attach solder fatigue and wirebond lift off, both the result of the strain caused by material CTE differences and the temperature excursions during switching.

The implementation of sinter material die attach addresses the solder fatigue issue, but the true ability of sintering to extend product endurance is only realized when traditional aluminum wirebond failures are eliminated.

In the new generation of devices, the topside attachment to the die uses sintered clips or sintered copper foils.  Clips are typically constructed of silver plated copper or pure silver, laminated and sintered to the die topside.  Alternatively, a copper foil can be laminated, then sintered to the die topside, supporting the increased reliability and current density of copper wirebonds.  Clips and foils, laminated with ALPHA Argomax film, enable an assembly ready interconnect for a fully sintered solution.