Product Overview

STAYSTIK 472 thermoplastic adhesive film is designed for use in a variety of electronic applications. STAYSTIK 472 is characterized by its excellent bonding at low process temperatures and extremely low elastic modulus (60,000psi).

The compliancy of STAYSTIK 472 adhesive allows for the bonding of two materials with large dissimilarities in thermal expansion coefficients (TCEs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features

  • Fast bonding to a variety of substrates
  • Easily reworkable material
Technical Data Sheet
TDS-icon

STAYSTIK 472 Adhesive Technical Data Sheet English

STAYSTIK 472

Product Name

Adhesive Type

Adhesive Format

Adhesive Technology

Adhesive Application

Deposition Method

Silver

STAYSTIK 472

Non-conductive

Film Preforms

Insulating

Structural Bonding
Reworkable
Wafer Coating

Lamination
Pressure Bonding
Pick & Place

None

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