Product Overview

STAYSTIK 371 thermoplastic adhesive paste is designed for use in a variety of electronic applications. STAYSTIK 371 is characterized by excellent bonding at low process temperatures and extremely low elastic modulus (60,000psi).

The compliancy of this adhesive allows for the bonding of two materials with large dissimilarities in thermal expansion coefficients (TCEs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features

  • Fast bonding to a variety of substrates
  • Easily reworkable material
Technical Data Sheet
TDS-icon

STAYSTIK 371 Adhesive Technical Data Sheet English

STAYSTIK 371

Product Name

Adhesive Type

Adhesive Format

Adhesive Technology

Adhesive Application

Deposition Method

Silver

STAYSTIK 371

Non-conductive

Paste

Insulating

Structural Bonding
Reworkable
Wafer Coating

Dispensing
Screen Printing
Wafer Coating

None

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