ALPHA OM-220 enables peak reflow temperatures below 150 °C, making it ideal for soldering heat sensitive components and sub-assemblies.
ALPHA OM-220 is designed to enable low Tg substrates such as PET laminates as well as permiting cascaded / hierarchical soldering. Its halogen and halide-free formulation complies with industrial standards without compromising on soldering performance.
- Low peak reflow temperature <150 °C
- Reduction of warpage of components and substrates during reflow
- Excellent printing performance
- Minimal and clear colorless residue
- Excellent electrochemical reliability
Ultra Low Peak Reflow Temperature
Ultra-low peak reflow temperature < 150 °C enables usage of heat sensitive components and low Tg substrates like flexible PCB.
Warpage induced defects can be mitigated with <150 °C peak reflow temperatures especially in heat sensitive designs like camera module, wearable devices etc.
Fine feature coalescence on heat stabilized PET substrates
ALPHA OM-220 is designed to be used on heat sensitive components and low Tg substrates. Even with it's low peak reflow temperature of < 150 °C, ALPHA OM-220 can achieve fine feature coalescence down to 170um on heat stabilized PET substrate making it an extremely useful solution for next generation flexible PCB assemblies.