Product Overview

ALPHA OM-220 enables peak reflow temperatures below 150 °C, making it ideal for soldering heat sensitive components and sub-assemblies.

ALPHA OM-220 is designed to enable low Tg substrates such as PET laminates as well as permiting cascaded / hierarchical soldering. Its halogen and halide-free formulation complies with industrial standards without compromising on soldering performance.

 

 

 

Product Features

  • Low peak reflow temperature <150 °C
  • Reduction of warpage of components and substrates during reflow 
  • Excellent printing performance
  • Minimal and clear colorless residue
  • Excellent electrochemical reliability
Technical Bulletins
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Documentation icon - Technical Bulletin

ALPHA OM-220 Solder Paste Technical Bulletin English

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Documentation icon - Technical Bulletin

ALPHA OM-220 锡膏 技术公告 简体中文

Product Flyers
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 Documentation icon - Flyer

ALPHA OM-220 Solder Paste Flyer English

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 Documentation icon - Flyer

ALPHA OM-220 锡膏 宣传页 简体中文

Ultra Low Peak Reflow Temperature

Ultra-low peak reflow temperature < 150 °C enables usage of heat sensitive components and low Tg substrates like flexible PCB.

Warpage induced defects can be mitigated with <150 °C peak reflow temperatures especially in heat sensitive designs like camera module, wearable devices etc.

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ALPHA OM-220 Reflow Profile
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Components on PET with ALPHA OM-220

Fine feature coalescence on heat stabilized PET substrates

ALPHA OM-220 is designed to be used on heat sensitive components and low Tg substrates. Even with it's low peak reflow temperature of < 150 °C, ALPHA OM-220 can achieve fine feature coalescence down to 170um on heat stabilized PET substrate making it an extremely useful solution for next generation flexible PCB assemblies.

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