Search
Product Overview
STAYSTIK 783 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK 783 is suitable for die and/or substrate attach in hybrid or multi-chip modules (MCMs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.
Features
- Meets MIL STD 883 requirements
- Extremely low outgassing
- Fast bonding to a variety of substrates
Technical Data Sheet
STAYSTIK 783 Adhesive Technical Data Sheet English
STAYSTIK 783
|
Product Name |
Adhesive Type |
Adhesive Format |
Adhesive Technology |
Adhesive Application |
Deposition Method |
Silver |
|---|---|---|---|---|---|---|
|
STAYSTIK 783 |
Non-conductive |
Paste |
Thermally Conductive |
Structural Bonding |
Dispensing |
Aluminum Oxide |
What do you need solved?
Let our experts find your solution.
Let our experts find your solution.