Product Overview

STAYSTIK 482 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK 482 can be used for die attach and/or substrate attach in hybrid or multi-chip modulus (MCMs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features

  • Meets MIL STD 883 requirements
  • Extremely low outgassing
  • Fast bonding to a variety of substrates
Technical Data Sheet
TDS-icon

STAYSTIK 482 Adhesive Technical Data Sheet English

STAYSTIK 482

Product Name

Adhesive Type

Adhesive Format

Adhesive Technology

Adhesive Application

Deposition Method

Silver

STAYSTIK 482

Non-conductive

Film Preforms

Insulating

Structural Bonding
Reworkable

Lamination
Pressure Bonding
Pick & Place

None

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