ALPHA® HRL3 Solid Solder
A low-temperature lead-free alloy designed to exhibit improved thermomechanical reliability and soldering performance.
Contact UsProduct Overview
ALPHA HRL3 Solid Solder is designed to enable low-temperature processes in selective and dip soldering applications. This alloy exhibits improved thermomechanical reliability compared to existing low-temperature alloys on the market. With the addition of special additives, ALPHA HRL3 demonstrates high mechanical properties, fast wetting, and reduced copper erosion during the soldering process.
ALPHA HRL3 is also suitable for low-temperature, lead-free solder paste users who require a compatible alloy for Pin Through Hole (PTH) applications.
Product Features
Enables Low Temperature in Selective and Dip Soldering Processes
Improves Energy Efficiency and Reduces Thermal Damage
Reduce energy costs and thermal damage, improving efficiency.
Comparable Hole Fill Performance and Solder Joint Strength to SAC305
Low Copper Erosion Compared to SAC305
Enhanced Low-Temperature Lead-Free Solid Solder
ALPHA HRL3 is suitable for use in low-temperature selective soldering processes on through-hole joints, as well as in dip soldering. It enables soldering at approximately 200–260°C while delivering fast wetting and excellent soldering performance compared to SAC305. ALPHA HRL3 yields Class 3 hole-fill solder joints on boards with thicknesses greater than 2.4 mm and has low copper erosion.
HRL3 Delivers Excellent Soldering Performance
ALPHA HRL3, with a special blend of additives, delivers high wetting performance and low copper erosion compared to SAC305 and Low Temp Alloy X.
