TDS

Low Stress Thermosetting Conductive Die attach Adhesive with High Thermal Conductivity

A Thermally conductive and electrically insulating die attach adhesive paste.

ATROX 590-4HT1 is a low stress thermosetting conductive die attach adhesive with high thermal conductivity designed for high power semiconductors and exposed pad semiconductor packages.

ATROX 800HT2V is a thermosetting conductive die attach adhesive with very high thermal conductivity designed for high power semiconductor packages.

A dispensable thermosetting conductive die attach adhesive with very high thermal conductivity designed for high-power semiconductor packages.

No clean paste flux with low residue post reflow and low voiding performance

No Clean Tacky Soldering Flux

No Clean Tacky Soldering Flux

ENTHONE 50 SERIES CAT L INK

Permanent Epoxy Marking Ink

The MICROFAB MP2500 is a high-speed copper process engineered for mega pillars applications. It provides exceptional within-wafer (WIW), within-die (WID), and within-feature uniformity (WIF, TIR).