'Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells' Article Published in SMT007 Magazine

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Solder Paste Printing and Optimization for Interconnecting Back Contact Cells

Narahari Pujari, Senior Global Product Manager, PV and Krithnika PM discuss ‘Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells’ in latest article published in July's SMT007 Magazine.

 

MacDermid Alpha's latest article in SMT007 Magazine, 'Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells', written by Narahari Pujari, Senior Global Product Manager, PV and Krithnika PM, Research and Development Scientist, discusses the advantages of using solder pastes as an alternative material for interconnecting back contact cells over ECA (electrically conductive adhesives) and traditional tabbing methods. Using solder pastes for interconnections enables the formation of reliable solder joints, better thermal and electrical conductivity compared to ECA and is a lower cost option than ECA.

The article investigates the application of the low temperature solder paste ALPHA OM-550 HRL1 in printing and optimizing joints in INC cells, and evaluates the printing, voiding, microstructure and reflowing properties of the paste.

To read the article in SMT007 Magazine, please click here. 

 

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