3rd Global xEV Powertrain Technology & Industry Conference

MacDermid Alpha Electronics Solutions will be present at the upcoming 3rd Global Powertrain Technology & Conference in Shanghai, China, on June 26th - 27th. 

Clark Dai, our EV (Electric Vehicle) Technology Marketing Manager, will be presenting on June 27th at 14.35 an “Overview of SiC Power Module and Traction Sintering Solutions”. This highlights how the MacDermid Alpha's power packaging applications can help in achieving increases in power density, improvements in reliability, and reducing size and weight. These features facilitate the potential to operate at higher temperatures in power electronics applications within the different three joining levels: top attach, die attach and package attach. 

We extend our invitation to visit us at booth 22 and discover how MacDermid Alpha’s integrated solutions can support you enhance EV Powertrain reliability. Our team of experts will be available to provide further insights, into these new manufacturing opportunities for sintering processes. You will also be able to explore our extensive portfolio of preforms, solder materials, sintering, and die attach solutions.  

We look forward to meeting you at the conference. Let us Power your Path towards a more efficient and sustainable future.