Brands

The Affinity family of ENIG and ENEPIG final finishes provide wire bondable and solderable surfaces for advanced boards.

Widely recognized alternative oxide process for adhesion promotion of copper innerlayers that is designed to replace black oxide.

Complete process that deposits a high-performance silver coating with exceptional first pass yields, excellent soldering, and long-term reliability.

Electrolytic gold plating processes for connectors and interconnects.

Industry leading sustainable carbon-based direct metallization process for metallizing through holes and micro vias.

Advanced high speed etching processes for innerlayer and outerlayer final etching.

Widely trusted alternative oxide process for innerlayer adhesion of multilayer printed circuit boards.

Advanced carbon-based direct metallization system for metallizing through holes and micro vias.

High performance zincate and electroless nickel coatings for aluminum memory disks.

Organic solderability preservatives widely trusted and qualified by global OEMs.

Environmentally friendly conductive polymer based primary metallization process that replaces electroless copper.

High performance silver anti tarnish for connectors and functional silver surfaces.

Electroplating processes for LED packaging.

Specialty manufacturing processes for photovoltaics.

Sulfamate based nickel alloys for connectors and interconnects.

Low etch copper adhesion promotion for high speed innerlayers.

Premium high reliability electroless copper process for primary metallization of PCBs.

Widely specified family of electrolytic copper plating processes for the plating of through holes and filling of micro vias.

Selective dielectric plating processes for printed electronics.

Popular brands for metallization of molded interconnect devices including ENPLATE LDS, SelectPrep and more.

High performance alternative oxide for innerlayer adhesion of copper innerlayers.

Electroless copper plating process for flexible printed circuit boards.

Copper surface treatment for innerlayer and soldermask adhesion promotion.

Black oxide process for innerlayer adhesion of copper innerlayers.

Widely specified immersion tin final finish for automotive printed circuit boards.

Adhesion promotion process for leadframe packages for copper to molding compound interface.

Metallization processes for laser direct structured molding compound for advanced packaging.

Immersion tin finish for QFN flanks.

Electrolytic palladium processes for connectors and interconnects.

Pure gold electroplating process for connectors and interconnects.

Electroplating processes for connectors, interconnects, and leadframe packaging.

Graphite-based advanced direct metallization that offers a sustainable replacement to electroless copper.

High efficiency matte and bright (MSA) tin process for connectors and interconnects.

High efficiency matte and bright (MSA) tin process for connectors and interconnects.

Leading immersion silver final finish process for printed circuit boards.

Family of IC substrate metallization processes for RDL, through hole filling, and embedded trace substrates.

Resist stripping process for PCB manufacturing.

Low internal stress horizontal electroless copper process for PTH and micro via metallization.