As the photovoltaics (PV) industry gravitates toward grid parity, chemical processing will deliver the cost, processing, and efficiency advantages needed to get us there. We are a world leader in specialty chemicals, bringing cutting-edge innovation and world-renowned technical service excellence to your facilities, anywhere, anytime. Our chemical processes enable the efficiency gains you need to win the brightest of futures.
- Pattern Formation: Pico-second laser ablation for fingers and buss bars
Seed Layer Plating: Metallization options for sputtered nickel or copper
Conductor: Nickel and copper metal stack utilizing LIP plating technology
Surface Finish: Immersion Silver, Tin, OSP
As the PV industry gravitates toward grid parity, chemical processing will deliver the cost, processing, and efficiency advantages needed to get us there. We are a world leader in specialty chemicals, bringing cutting-edge innovation and world-renowned technical service excellence to your facilities, anywhere, anytime. Our chemical processes enable the efficiency gains you need to win the brightest of futures.
MacDermid Enthone provides numerous options for the deposition of metals to form the conductor grids on solar cells. These options include electrolytic, electroless, and immersion deposition options for metals such as nickel, copper, silver, and tin.
Your cell's solderable finish represents your connection to the outside world. Each of the cell's electrons needs to be transmitted through the conductor to the module strings without loss while achieving maximum consistency. Our metal finishing options provide long-term prevention of conductor oxides allowing for easy soldering with any flux system and solder alloy. Each product allows superior functionality for front or rear side plating and can also be used with conductive paste contacts used in shingling applications. Plated metal conductors significantly outperform sintered paste for conductivity, allowing finger-width reductions to 20 microns or less. Immersion silver and immersion tin surface finish options also provide superior solderability for solder tabbing as well as reduced contact resistance for modules utilizing shingling technologies.
Light-induced plating (LIP) electrolytic nickel is used as the barrier layer between the silicon and the plated copper layer. The nickel layer is typically around 1 um thick and must exhibit low stress and a dense, uniform deposit.
Full-build, high-purity, low-stress copper for fast deposition of up to 50 microns thickness for the ultimate finger and busbar conductivity. Easily finished with silver or tin. Helios Electrolytic Copper is available in light-induced formulation as well.
Cyanide-free. The highest conductivity metal deposit for use as a full-build conductor, plating on silver paste, or the final coating on copper or nickel deposits. Helios Electrolytic Silver can be applied utilizing LIP or in fully electrolytic mode.
Silver protects the conductors for soldering with the most functional and cost-competitive surface finish available. Helios Immersion Silver applies a deposit of pure silver in high-speed batch or conveyorized equipment without the need for electrolytic contact.
For PV applications that specify tin as the final solderable finish, the industry chooses Helios Immersion Tin. The production-proven chemistry can be used in various plating tool types with excellent solderability and resistance to environmental contamination.
Our Alpha brand solder interconnect technology helps optimize your PV assembly process. Our global experts can guide you through choosing the right set of materials for high throughput, high-yield production, and high efficiency, high reliability solar modules. Use Alpha products for: liquid tabbing & stringing fluxes, solder wire, solder paste, and solder preforms.