Product Overview

POLYSOLDER SE3001 is cured by thermal processing in IR, convection, conduction or vapor phase equipment.

A combination of short cure time, low temperature cure and excellent thermal stability results in superior mechanical properties and stable contact resistance during stress tests and device operation.

POLYSOLDER SE 3001

Features

  • Meets MIL STD 883 requirements
  • Extremely low outgassing
  • Fast bonding to a variety of substrates
     
Technical Data Sheet
TDS-icon

POLYSOLDER SE3001 Technical Data Sheet English

POLYSOLDER SE3001

Product Name

Adhesive Type

Adhesive Format

Adhesive Technology

Adhesive Application

Deposition Method

Silver

POLYSOLDER SE3001

Conductive

Paste

Electrically Conductive

Structural Bonding

  

Silver

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 181AK STAYCHIP F614-3A

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 181AK STAYCHIP F614-3A

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Sensors Medical Devices Optoelectronics Packaging

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Sensors Medical Devices Optoelectronics Packaging

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 181AK STAYCHIP F614-3A

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

STAYSTIK 181AK STAYCHIP F614-3A

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Sensors Medical Devices Optoelectronics Packaging

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Sensors Medical Devices Optoelectronics Packaging

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Thermal Management

STAYSTIK adhesives offer excellent reliability and high throughput for various applications. Highlighted by excellent reworkability, adhesion, low ionics and low outgassing properties.

Structural Bonding Thermal Management
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