ENTEK® PLUS IC
Organic solderability preservative (OSP) for IC substrate fabrication with industry leading OSP coating thickness capability.
Contact UsProduct Overview
ENTEK® PLUS IC Organic Solderability Preservative’s (OSP) industry leading thickness capability allows unrivalled shelf life, providing supply chain flexibility and performance risk elimination associated with other OSP’s. With proven resistance to de-flux materials, ENTEK® PLUS IC OSP maintains thickness through cleaning operations, delivering reliable performance for subsequent assembly operations ensuring yield maximization.
Product Features
Industry Leading OSP Coating Thickness Capability
Provides greatly increased protection to copper surfaces on storage when compared to competitive OSP coatings.
Performance Risk Elimination
The process enables 24-month shelf life under best practice storage, and is visually unchanged after multiple nitrogen reflows, retaining optimum performance.
Strongest Possible Solder Joints
ENTEK PLUS IC’s interaction with assembly materials has been optimized and verified through extensive solder-spread, ball-shear and drop shock testing.
Enhanced Surface Protection
ENTEK PLUS IC OSP provides greatly increased protection to copper surfaces when compared to competitive OSP coatings. Accelerated age tests based on the Arrhenius Peck model demonstrates that ENTEK PLUS IC exhibits no reduction in solder spread performance, providing industry leading storage times (under best practice conditions) of up to 24-months providing greater supply chain flexibility.
High Tolerance to Deflux Chemistry
ENTEK PLUS IC OSP coatings allow higher OSP thickness to remain on copper surfaces after nitrogen reflow. The thermally robust OSP molecule is able to maintain a higher OSP thickness through the Integrated Circuit (IC) substrate manufacturing process, allowing ENTEK PLUS IC more tolerance to deflux chemistry and baking operations during the fabrication process, maximizing yields at final assembly.
High Reliability Solder Joints
ENTEK PLUS IC produces the preferred Cu-Sn intermetallic upon soldering. In collaboration with our Circuit Board Assembly team, ENTEK PLUS IC performance has been verified and optimized through extensive solder-spread, ball-shear and drop shock testing
Featured Applications
Mobile Devices
Extensive drop-shock testing to the IPC/JEDEC-9706 standard shows ENTEK PLUS IC produces a solder joint with the highest reliability when exposed to free fall impact.
Automotive
ENTEK PLUS IC provides performance and yield improvements for complex designs.
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Product Documentation
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