High-Throw DC
Create advanced mid-aspect-ratio boards with high-throw DC acid copper plating that boosts performance, reliability, and versatility.
Learn MoreElectrolytic Copper Metallization
Advanced acid copper solutions for all applications, from ultra-high aspect ratio plating to filling the smallest blind microvias.
Proven Copper Plating Solutions
Optimize your Printed Circuit Board (PCB) designs with our production-proven electrolytic copper metallization processes, backed by industry-leading expertise and service. Enhance thermal conductivity, process control, and reliability across all features.
Design-enabling Copper Plating
Enhance Thermal Management
Advanced plating solutions enable complete and efficient filling of complex via, through-hole, and trench designs, ensuring optimal heat management.
Enable High Aspect Ratio and Thick Board Capability
Electrolytic copper solutions for conformal, high-aspect ratio plating of through-holes with excellent uniformity, enabling more complex board designs.
Optimize Power Management
Advanced chemistries, engineered for precise and complete filling of complex features, ensure compliance with electrical design rules.
Ensure Reliability Across Interconnections
Our electrolytic copper metallization processes enable complex stacked microvia designs without compromising reliability.
Achieve Simple, Predictable Process Control
Our user-friendly chemistries are designed for the manufacturing environment, featuring clear control specifications and human technical support when needed.
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Periodic Pulse Reverse
Ensure reliable plating for thick, multi-layer PCBs with PPR solutions, offering uniform coverage of high-aspect-ratio through-holes.
Learn MoreVia Fill
Optimize your PCB designs with high-performance copper via filling solutions, engineered to tackle any metallization challenge.
Learn MoreWhy MacDermid Alpha?
Integrated Solutions
Our full range of copper metallization solutions for advanced PCB and Integrated Circuit (IC) substrate fabrication is backed by industry-leading technical support capabilities.
Sustainability
Our solutions are designed for greater metal selectivity, waste reduction, and higher manufacturing yields, helping customers achieve sustainable production goals.
Reliability
Our electrolytic copper metallization solutions are proven to deliver high reliability in microvia, through-hole, and trench applications.
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Frequently Asked Questions
Why is electrolytic copper metallization used in PCB manufacturing?
Copper plating is essential in manufacturing advanced printed circuit boards. A well-designed and controlled process provides the capabilities needed to build today’s advanced electronic devices.
What are the benefits of electrolytic copper metallization in HDI designs?
In High-Density Interconnect (HDI) designs, electrolytic copper metallization ensures precise plating, superior conductivity, and mechanical strength for small vias, through-holes, and fine features—critical for high-performance electronics.
How does electrolytic copper metallization improve thermal conductivity?
Electrolytic copper metallization enhances thermal conductivity in PCBs by filling vias and through holes with copper, which efficiently disperses heat, preventing overheating and improving device reliability.
What is the impact of electrolytic copper metallization on PCB reliability?
Electrolytic copper metallization improves PCB reliability by ensuring strong copper plating that meets Institute of Printed Circuit Boards (IPC) standards for tensile strength, elongation, and resistance to V-pitting, even in complex designs.
How does electrolytic copper metallization support IC substrate applications?
In IC substrate applications, electrolytic copper metallization provides consistent, high-quality plating for filling blind microvias and X-vias, ensuring excellent coplanarity and low-profile traces for advanced circuit designs.