Product Overview

ALPHA OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 °C and superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HIP). 

The ALPHA OM-565 chemistry enhances electrochemical performance over existing low melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications. 

Product Features

  • Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability.
  • The HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects. 
  • Low melt point reflow improves energy efficiency and reduces energy costs in the assembly process. 
  • Superior HiP/NWO performance.
  • Compatibility with contact rework applications.
  • 8-hour stencil life in ambient and elevated conditions.
Technical Bulletins
Documentation icon - Technical Bulletin

ALPHA OM-565 HRL3 Solder Paste Technical Bulletin English

Documentation icon - Technical Bulletin

ALPHA OM-565 HRL3 锡膏 技术公告 简体中文

Product Flyers
 Documentation icon - Flyer

ALPHA OM-565 HRL3 Solder Paste Flyer English

 Documentation icon - Flyer

ALPHA OM-565 HRL3 锡膏 宣传页 简体中文

Minimizes Warpage Induced Defects to Maximize Assembly Yield

Next generation devices require a larger footprint and thinner form factor design that deliver superior processing power over existing technologies. These next generation packages create challenges for assembly at traditional SMT reflow temperatures. ALPHA OM-565 HRL3 enables a reduction in peak reflow down to 175 °C to mitigate common warpage induced defects such as HiP and NWO to improve assembly yields.

ALPHA OM-565 HRL3 Solder Paste Charts
ALPHA OM-565 Drop Shock Weibull

HRL3 Alloy Improves Reliability Over Existing Low Temperature Solutions

ALPHA OM-565 HRL3 microalloying additions continue to enhance the mechanical reliability over existing best-in-class low temperature solutions. The resulting ductility of the HRL3 alloy and superior wettability of the ALPHA OM-565 chemistry further advances the drop shock performance of low melt point alloys.

Enhances the Environmental Sustainability of the Assembly Process

The HRL3 alloy offers a significant reduction in peak reflow temperature over existing SAC reflow conditions. The ability to reliably solder at 175 °C peak temperatures will increase the efficiency of existing assembly processes while lowering the manufacturers net impact on its surrounding environment. 

ALPHA Sustainability Image
What do you need solved?
Let our experts find your solution.