10 results
Systek™ BAF Ni
Next-generation boric acid-free nickel barrier technology enables excellent coplanarity for high performance packages.
Learn moreSystek™ HCP 100
High-speed acid copper plating process provides exceptional uniformity for mega pillar applications.
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High-speed copper pillar plating delivering a high-purity deposit for advanced panel level packaging applications.
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High-precision acid copper system for simultaneous via filling and RDL line plating.
Learn moreSystek™ ETS Series
Advanced DC acid copper pattern plating specifically formulated to plate fine lines and pads in embedded trace substrates.
Learn moreSystek™ MV 400
DC acid copper pattern plating process specifically designed for consistent void-free filling of vias for 2-in-1 RDL applications.
Learn moreSystek™ THF Series
Copper through hole filling process that enables improved thermal and structural designs for Integrated Circuit (IC) substrates.
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Electroless copper plating process that deposits electroless copper with stellar physical properties.
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Systek™ SAP Desmear
Three step desmear process that can be calibrated to optimally prepare multiple substrate materials.
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Systek™ UVF Series
2-in-1 RDL via fill solution for fine feature plating of blind microvias, X-vias, and fine lines and pads in a single bath.
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