Systek™ MV 400

DC acid copper pattern plating process specifically designed for consistent void-free filling of vias for 2-in-1 RDL applications.

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Product Overview

Systek MV 400 is a Direct Current (DC) acid copper pattern plating process specifically designed for 2-in-1 Redistribution Layer (RDL) applications. It consistently fills vias without voids and plates surface features such as traces and pads with excellent coplanarity in a single step at high current densities. The production proven, three-component system is fully Cyclic Voltammetric Stripping (CVS) analyzable.

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