Systek™ VTP 100
High-precision acid copper system for simultaneous via filling and RDL line plating.
Contact UsProduct Overview
The Systek™ VTP 100 acid copper plating system offers unmatched precision for Redistribution Layer (RDL) plating and via filling across a wide range of line, space, and via dimensions. Ideal for 3D and fan-out designs, Systek VTP 100 is part of our Panel Level Packaging (PLP) Portfolio, enabling seamless I/O re-routing and uniform line profiles. The chemistry enables plating speeds of up to 7.5 ASD and is formulated to achieve bottom-up via filling while maintaining a flat line profile with excellent uniformity.
Product Features
Excellent Via Fill Capability
Systek VTP 100 delivers high precision via fill capability and RDL performance for many devices and a wide range of line, space and via dimensions.
High-Speed Plating
Systek VTP 100 is capable of plating speeds up to 7.5 ASD depending on via size, and is formulated to achieve bottom-up via filling.
Good Physical Properties
Maintains a flat line profile with excellent uniformity.
Enabling Efficient I/O Pitch Redistribution and Advanced Plating Precision
Systek VTP 100 supports simultaneous plating of RDL lines and bottom-up via filling, creating strong, uniform connections across a wide range of line, space, and via dimensions. The bottom-up via filling and uniform RDL line plating ensures stability and efficiency across complex designs.
RDL Plating and Via Filling
Systek VTP 100 enables simultaneous plating of RDL lines and via fill.
Product Documentation
No Documents Found
We can't seem to find the documentation right now. Please reach out to us and we'll get what you're looking for.
Contact us