Systek™ SCP 100
High-speed copper pillar plating delivering a high-purity deposit for advanced panel level packaging applications.
Contact UsProduct Overview
Systek™ SCP 100 high-speed copper pillar electroplating process provides manufacturers with excellent uniformity, coplanarity and precision. This helps them meet the requirements of next-generation high-performance computing and Artificial Intelligence (AI) applications. Part of our Panel Level Packaging (PLP) Portfolio, Systek SCP 100 delivers a high-purity, Kirkendall Void (KV)-free deposit with exceptional uniformity and a flat bump profile. With high-plating speed capabilities up to 2.5 μm/min, the versatile, 3-part additive chemistry is compatible with and without nickel barrier and various solders.
Product Features
High-Speed Plating Capabilities
Systek SCP 100 is a high-speed plating process with capabilities up to 2.5 μm/min. The technology delivers excellent uniformity and a flat bump profile.
High-Purity Deposit
Systek SCP 100 delivers a high-purity, Kirkendall void-free deposit with <15 ppm total film impurity for enhanced reliability and performance.
Versatile Chemistry
This versatile chemistry is suitable for different area ratio pillars and line/space of Redistribution Layer (RDL). Systek SCP 100 is methanol-free for ESG compliance.
Innovative Copper Pillar Process for Panel Level Packaging Applications
Systek SCP 100 enables enhanced performance and reliability for next-generation packaging designs. This highly pure system eliminates Kirkendall Voids (KVs), exhibiting excellent reliability performance vs traditional copper, even when the bath is aged.
Pillar and RDL
Systek SCP 100 is suitable for different area ratio pillars and line/space of RDL in advanced packaging applications.
