Systek™ SAP Copper
Electroless copper plating process that deposits electroless copper with stellar physical properties.
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Product Overview
The Systek SAP copper metallization process is a high-performance Semi-Additive Process (SAP) primary metallization for Integrated Circuit (IC) substrates, featuring multiple process improvements. The system is specifically designed as a metallization seed layer for unclad build-up substrates and is composed of a complete line of process chemistry, including desmear, conditioning, activation, and metallization processes. To complete the build-up process, Systek SAP is compatible with Systek’s advanced 2-in-1 plating technology, allowing simultaneous filling of copper microvias and plating of traces. The combined process improvements of Systek SAP enable very high-density circuitry with minimal substrate roughening, enhancing layer performance and reliability.