Systek™ SAP Desmear
Three step desmear process that can be calibrated to optimally prepare multiple substrate materials.
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Product Overview
Systek SAP begins with a three-step Semi-Additive Process (SAP) desmear process that can be calibrated to optimally prepare multiple substrate materials, depending on the fabricator’s design requirements. First, a permanganate etch removes laser debris from via walls and target pads. Next, a neutralizer reduces permanganate residues from the surface. Finally, a glass etch promotes uniform palladium adsorption on glass build-up materials. The result is a perfect balance of minimal roughness and consistently clean via sidewalls and copper target pads for maximum adhesion.