Backside Metallization
Optimize via step coverage, yield, and reliability for power/RF with our solutions that integrate seamlessly with die attach material.
Learn MoreCompound Semiconductor Electroplating Solutions & Metallization
Industry-leading compound semiconductor electroplating solutions and metallization / precious metal plating technologies are engineered for superior reliability, performance, and cost efficiency while accelerating time to market.
Advanced Precious Metal Plating
Enhance semiconductor performance with our precious metal plating solutions, designed to enable the fastest time to market at the lowest cost of ownership.
Our gold and palladium systems provide excellent fine-line capability, superior step coverage, and consistent electrical and mechanical characteristics.
Enhance Reliability & Performance
Achieve Fine Pitch Plating Precision
Our gold electroplating solutions deliver exceptional capabilities for fine-line features, bump plating, via step coverage, and backside interconnect solutions.
Enhance Cost of Ownership with Gold De-Plating Solutions
Our non-cyanide deplate chemistry complements gold plating processes, delivering consistent gold etch results with minimal undercut of critical features.
Ensure Reliable, Durable Palladium Plating
Our palladium plating solutions offer excellent corrosion resistance, high thermal stability, and consistent material properties valued in Micro-Electro-Mechanical Systems (MEMS) manufacturing.
Improve Adhesion for Semiconductor Reliability
Our gold and palladium strike plating solutions enhance reliability by improving adhesion and minimizing contamination of subsequent metal layer steps.
Benefit From Reliability with Palladium Pre-Plating
Pure palladium pre-plating improves reliability and adhesion on passivated surfaces, such as nickel, that undergo subsequent soldering or die attach processing.
Explore Categories
Display Driver Interface (DDI)
Achieve superior bondability, reliability and thermal stability of display driver applications with our high-hardness gold solutions.
Learn MoreFOWLP Solder Surfaces
Design next-generation Fan-Out Wafer Level Packaging (FOWLP) with our advanced gold and palladium solutions for thin metal films.
Learn MoreGold Etch Materials
Ensure precise, uniform gold seed removal on TiW barriers with advanced, cost-effective gold etchants for semiconductor fabrication.
Learn MoreMicro-Electromechanical Systems (MEMS)
Enable high plating rates and superior step coverage with our advanced, cost-effective solutions for MEMS fabrication.
Learn MoreRedistribution Layer for WLP
Enhance solderability and conductivity with high-purity deposits, seed filling, and adjustable roughness for advanced semiconductors.
Learn MoreWhy MacDermid Alpha?
Integrated Solutions
Our complete range of pre-plate, strike and electroplating & metallization solutions ensure that you achieve superior results for your compound semiconductor applications.
Sustainability
We provide non-cyanide gold plating solutions to help our customers meet their Environment Health & Safety (EH&S) goals and maintain performance in compound semiconductor applications.
Reliability
Achieve unmatched corrosion resistance, high thermal stability and improved adhesion with our portfolio of compound semiconductor solutions.
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Frequently Asked Questions
What is compound semiconductor fabrication?
Compound semiconductor fabrication involves creating semiconductor products made from substrates containing multiple chemical elements. (i.e Gallium Arsenide, Silicon Carbide, & others). Compound semiconductors are most useful in applications such as Radio Frequency (RF), Power Integrated Circuits (IC's), Optoelectronics & Light-Emitting Diodes (LED's).
What are the challenges in compound semiconductor fabrication?
Challenges include fine-pitch patterning, step coverage into vias, thermal management, and achieving reliable interconnect surfaces. Advanced plating techniques enabled with materials like gold, palladium, and silver solutions can enhance the performance and durability of each die.
How does gold plating improve compound semiconductor fabrication?
Electroplated gold features have a historic acceptance in compound semiconductor devices due to the material compatibility with the substrates, as well as advantageous material properties for low stress and thermal behavior. Our gold solutions enable fine line features, outstanding step coverage into vias, and favorable surface characteristics for backside interconnects and die attach.
What are the benefits of using palladium in compound semiconductor & MEMS fabrication?
Palladium plating enhances compound semiconductor fabrication by enabling superior adhesion of layers on top of metals such as nickel. Palladium also enables high reliability solderable finishes when gold is used as a topcoat. Palladium and palladium alloys offer MEMS devices unique and favorable mechanical and electrical characteristics.
How does non-cyanide deplate technology reduce costs in compound semiconductor fabrication?
Non-cyanide deplate technology reduces the operating costs in compound semiconductor fabrication by eliminating dangerous materials such as cyanide, Potassium Iodide (KI), or strong acids. Electrolytic deplate processing offers safer, more cost-efficient processing without compromising performance in gold plating applications.