Systek™ UVF Series
2-in-1 RDL via fill solution for fine feature plating of blind microvias, X-vias, and fine lines and pads in a single bath.
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Product Overview
Redistribution layers in Integrated Circuit (IC) substrate manufacturing require metallization of fine structures, such as blind microvias, X-vias, and fine lines and pads. The Systek UVF Series enables 2-in-1 Redistribution Layer (RDL) plating of these features in a single bath. Its precise chemical system fills blind microvias and X-vias with minimal dimples or overfill, eliminating concerns about dielectric thinning and providing an excellent base for stacking.
Product Features
Advanced RDL and Via Filling
The Systek UVF Series is specially designed for 2-in-1 RDL via fill and fine line plating in IC substrates.
Single Step Via Filling and Fine Line Plating
Systek UVF fills blind microvias and X-vias while simultaneously plating fine lines and other surface features with high coplanarity and low trace profiles.
Excellent Coplanarity
The Systek UVF Series provides high coplanarity across all features, with an R value of less than 2µm.
Systek UVF 300
Systek UVF 300 is an advanced acid copper plating process for 2-in-1 RDL applications, designed to plate fine lines and fill vias in a single solution. The process delivers excellent coplanarity across all features, with an R value of less than 2 µm. Systek UVF 300 maintains trace profiles consistently between 10-15% and is optimized for use in High-Speed Plating (HSP) tools.
Featured Applications
Redistribution Layer
The Systek UVF Series is the ideal choice for 2-in-1 RDL applications using high-speed plating equipment, where maintaining trace profiles, uniformity across all features, and excellent via fill performance are critical.