Achieve Six Sigma assembly performance and exceptional reliability with our ENEPIG corrosion-free, high-uniformity deposits.
Affinity™ Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) provides a corrosion-free nickel-palladium-gold surface with hybrid gold deposition, ensuring reliable wire bonding and superior solderability. It supports long-term reliability for Integrated Circuit (IC) substrates and advanced packaging designs.
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Our deep understanding of the interaction between final finishes and circuit board assembly materials allows us to deliver the highest reliability solutions.
Sustainability
With extended bath life, reduced precious metal content, lower operating temperatures, and dummy-free chemistry, we provide significant ESG advantages for fabricators and OEMs.
Reliability
Product development guided by Six Sigma methodology eliminates waste and enhances reliability throughout the development process.
Affinity™ ENEPIG delivers a uniform, corrosion-free nickel-palladium-gold finish. It ensures strong gold wire bonds, excellent solderability, and stable performance over time, even after multiple reflow exposures, making it a top choice for IC substrate manufacturing.
The hybrid gold deposition in Affinity™ ENEPIG creates a highly bondable, corrosion-resistant surface, ensuring reliable wire bonding even after multiple thermal cycles. This results in strong, long-lasting connections for electronic devices.
Affinity™ ENEPIG combines electroless nickel, electroless palladium, and immersion gold to create a corrosion-free surface with superior wire bondability. Unlike traditional finishes, it maintains stable solderability and bond strength, even after multiple reflow exposures.
Affinity™ ENEPIG delivers a durable, corrosion-resistant finish that maintains performance across multiple thermal cycles. It provides stable wire bond strength and excellent solderability, ensuring reliable long-term performance in electronic devices.
The electroless nickel, palladium, and immersion gold layers of Affinity™ ENEPIG provide a highly solderable surface with excellent ball shear results, ensuring seamless assembly and extended device lifetimes.
