Systek™ ETS Series

Advanced DC acid copper pattern plating specifically formulated to plate fine lines and pads in embedded trace substrates.

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Product Overview

Systek ETS features: 

  • Fine line pattern plating down to 5/5 µm line/space
  • High coplanarity of traces and pads with R-Values < 2 µm
  • Excellent trace profile for controlled impedance
  • Low-stress deposit exceeds IPC Class III standards for tensile strength and elongation eliminating concerns of warpage due to metallization

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