Systek™ HCP 100
High-speed acid copper plating process provides exceptional uniformity for mega pillar applications.
Contact UsProduct Overview
Systek™ HCP 100 copper pillar bath chemistry achieves high-speed plating rates of 8 μm/min, delivering high-purity bumps with excellent coplanarity for enhanced reliability. Part of our Panel Level Packaging (PLP) portfolio, Systek HCP 100 enables high throughput, a flat bump shape, and low Kirkendall void (KV) capability, ensuring high performance and reliability for advanced interconnects.
Product Features
High Speed Chemistry
Plating speeds of up to 8 μm/min can be achieved with Systek HCP 100 for mega pillar applications, enabling high throughput.
Excellent Coplanarity
Systek HCP 100 provides excellent coplanarity, Within-Die (WID) and Total Indicator Reading (TIR) at high circuit densities with a flat bump shape.
Versatile Chemistry
Suitable for a wide range of area ratios and circuit densities.
Exceptional Uniformity for Advanced Packaging Applications
Smaller form factors and integration technologies are driving the demand for highly co-planar and flat features to achieve high reliability and yield. Systek HCP 100 enables exceptional Within-Die (WID) and Within-Feature (WIF, TIR) uniformity for a wide range of area ratios and circuit densities.
Mega Pillar
Systek HCP 100 is designed to achieve high performance and reliability for advanced interconnects.
