Our conductive hole-making processes offer sustainability, cost savings, and reliability, outperforming traditional methods with reduced waste and energy use.
Our carbon- and graphite-based direct metallization solutions, including our Blackhole® and Shadow® processes, reduce waste, power, and water usage while eliminating formaldehyde and other hazardous chemicals.
Compared to electroless copper, our processes offer cost-effective, high-performance solutions.
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Unlock high performance and increased board capacity with our conductive polymer-based direct metallization system.
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Optimize the performance of multilayer boards with high-reliability electroless copper plating for demanding PCB applications.
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Our comprehensive portfolio of electroless copper, direct metallization, and final finishes ensures consistent, high-quality plating on any board material.
Sustainability
Precious metal-free primary metallization solutions reduce resource usage and waste, promoting sustainable, efficient Printed Circuit Board (PCB) fabrication.
Reliability
Direct and electroless copper primary metallization processes ensure reliability for high-speed, multilayer, and advanced printed circuit boards.
Direct metallization creates a conductive layer on non-metallic surfaces like plastics or composites without electroless copper plating. It ensures high-performance bonding and is integral to advanced Integrated Circuit (IC) substrate and PCB manufacturing.
Direct metallization reduces waste, water, and power consumption compared to traditional electroless copper processes. It also eliminates the need for hazardous chemicals like formaldehyde and precious metals such as palladium.
Direct metallization reduces operational costs, enhances throughput, and minimizes environmental impact. It eliminates hazardous chemicals while ensuring reliable copper-to-copper bonding for advanced substrates and high-density designs.
Direct metallization uses carbon or graphite alternatives, replacing electroless copper processes that rely on palladium or formaldehyde. This approach is more cost-effective, environmentally friendly, and well-suited for advanced substrates.
Shadow® Plus, our latest-generation direct metallization solution, builds on prior innovations to deliver enhanced performance. When paired with our wet-etch technology, it significantly reduces power and water consumption, advancing both efficiency and sustainability.
