Systek™ THF Series
Copper through hole filling process that enables improved thermal and structural designs for Integrated Circuit (IC) substrates.
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Systek THF Series is a copper through hole filling process that enables improved thermal and structural designs for IC substrates. It provides a solid copper-filled through hole in core Printed Circuit Board (PCB) layers, offering higher thermal conductivity than paste without the thermal expansion commonly encountered with other materials. The process fills through holes in a fraction of the time required by direct current plating, with minimal dimple and no need for surface planarization. This simplifies the addition of subsequent build-up layers.