961 results
Tin-Lead (SnPb) Bar Solder
Manufactured through a specialized process that controls the inclusion of oxides and metallic and non-metallic impurities.
Learn moreALPHA® NCP-390 Solder Paste
No-clean, lead-free solder paste meets zero-halogen specs with low voiding and excellent fine-feature printing performance.
Learn moreALPHA® NCP-LR002 Solder Paste
No-clean, low-residue, lead-free solder paste that meets zero-halogen specs with low voiding and excellent soldering performance.
Learn moreALPHA® WS-945CPS Solder Paste
Lead-free, water-soluble solder paste supports 50µm printing, minimal voiding, and excellent cleaning.
Learn moreALPHA® Argomax® 5040 Paste
Sinter silver paste for die attachment on copper, designed for wet paste placement and low-pressure sintering.
Learn moreMICROFAB® CU1000
High-speed copper plating process for copper pillars in flip chip packages, microbumps in 3D interconnects, and RDL.
Learn moreMICROFAB® CUMSA100
High-purity electroplating process produces equiaxed-grained matte copper deposits for bump/pillar fabrication.
Learn moreMICROFAB® GSW-100
Acid copper plating process engineered to produce low-stress, pure copper deposits.
Learn moreMICROFAB® GSW-200
Unique acid copper plating system designed for filling blind vias across various geometries.
Learn moreMICROFAB® SC
High-speed copper plating process for copper pillars in flip chip packages, copper microbumps in 3D interconnects, and RDL.
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