961 results
NEUTRONEX STRIKE
Gold strike plating process designed to improve adhesion and prevent unwanted contamination from entering the main gold plating solution.
Learn moreALPHA® HiTech® SM42-120P Adhesive
A one-component, fast-curing surface mount adhesive, specifically designed for screen printing.
Learn moreHRL3
A low temperature lead-free alloy designed to exhibit improved thermomechanical reliability and soldering performance.
Learn moreInnolot® MXE
Proven to significantly enhance thermal cycling, vibration, and drop shock performance over existing high-reliability offerings.
Learn moreSAC 305
A lead-free alloy delivering best-in-class yield, outperforming Sn/Cu-based materials.
Learn moreLow and No-Silver Lead Free Alloys SACX Plus 0307, SACX Plus 0807
Suitable for wave soldering and selective soldering for electronic assemblers interested in implementing a lead-free process.
Learn moreALPHA® OM-353 Solder Paste
Broad latitude for high-reliability applications requiring process flexibility and residue containment, lead-free and zero-halogen.
Learn moreALPHA® WS-826 Solder Paste
Water-soluble solder paste for fine features with excellent stencil life in ambient and elevated conditions, lead-free and zero-halogen.
Learn moreKester® NP505-HR Solder Paste
A zero-halogen, lead-free, no-clean solder formula offering flexibility across a broad range of print and reflow conditions.
Learn moreKester® NP575-KAP Solder Paste
Developed for high first-pass yields, this reliable material is ideal for automotive, aerospace, and other demanding applications.
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