ALPHA® WS-945CPS Solder Paste
Lead-free, water-soluble solder paste supports 50µm printing, minimal voiding, and excellent cleaning.
Contact UsProduct Overview
ALPHA WS-945CPS is specifically designed for System-in-Package (SiP) applications involving numerous small components. It is optimized for the smallest solder powders, including Types 6 and 7, and is compatible with a wide range of lead-free solder alloys, making it an ideal solution for devices with precise and diverse requirements.
Product Features
Reliable
Consistent printing performance with apertures as small as 50μm, using a 25μm stencil.
Print Performance
Excellent repeatability in print volume deposition.
Meets Requirements
Compliance with IPC 7095 Class III voiding requirements.
Wetting Performance
In an N2 environment reflow, the ALPHA® WS945CPS SAC305 solder successfully passed the Random Solder Ball Test. Additionally, minimal powder residue was observed on the ceramic board post-reflow. The solder also demonstrates excellent wetting in the N2 environment reflow process.
Solder Paste Stability - Stencil and Storage Life
After over 8 hours on the stencil, ALPHA® WS945CPS SAC305 demonstrates exceptional stability. Variation in metal content is minimal, ensuring consistent performance. Tackiness remains stable, providing reliable adhesion properties. This stability minimizes process variation and enhances production efficiency. Overall, the exceptional stability of ALPHA® WS945CPS SAC305 solder paste increases confidence in assembly quality.
Printing Performance
ALPHA® WS945CPS SAC305 Type 7 solder paste demonstrates exceptional transfer efficiency across various opening sizes:
- 70 µm Opening: Achieves a transfer efficiency of 70-140%, maintaining consistent performance across all tested conditions, with the exception of noted outliers.
- 80 µm Opening: Delivers a transfer efficiency of 80-140%, ensuring reliable results under all standard conditions, excluding identified outliers.
Excellent Bridging / Slump Summary
ALPHA® WS945CPS SAC305 Type 7 solder paste effectively meets bridge and slump test requirements for apertures ranging from 40 to 70 µm. With over 90 prints conducted, it consistently shows no signs of slump or bridging. This reliability ensures high-quality performance across various applications. Trust our solder paste to deliver superior results and maintain precision throughout your manufacturing processes.
Featured Applications
High Density
ALPHA® WS945CPS SAC305 Type 7 solder paste is designed for fine-pitch and high-density applications, providing excellent print resolution.
Fine Pitch
ALPHA® WS945CPS SAC305 Type 7 solder paste is designed for fine-pitch and high-density applications.