MICROFAB® CUMSA100
High-purity electroplating process produces equiaxed-grained matte copper deposits for bump/pillar fabrication.
Contact UsProduct Overview
MICROFAB CUMSA100 enables high plating rates for high throughput, leading to a lower cost of ownership. This is achieved through a low consumption additive and simple, easy bath maintenance. The process produces equiaxed-grained matte copper deposits and is specially formulated for the fabrication of bumps/pillars on semiconductor wafers. High-build bumps/pillars can be produced on fine semiconductor patterns for excellent performance.