MICROFAB® GSW-100
Acid copper plating process engineered to produce low-stress, pure copper deposits.
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The MICROFAB GSW-100 Copper process has been engineered to produce a low-stress copper deposit in compound semiconductor, backside, and via conformal plating applications. It provides good throwing power into via bottoms. The deposit is low-stress and pure. This product is formulated, packaged and quality controlled according to the needs of the semiconductor industry.