MICROFAB® GSW-200
Unique acid copper plating system designed for filling blind vias across various geometries.
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MICROFAB GSW-200 is a mid-purity plating system that works with or without a Ni barrier. Its ability to level pads reduces solder usage, lowering the cost of ownership.
The process produces bright, fine-grained, ductile deposits with excellent physical properties. It enables complete via filling, minimizes surface deposition, reduces cycle time, and eliminates the need for planarization.
This process supports stacked via constructions and enhances reliability for via-in-pad designs.