961 results
STAYDRY® Z20
A film-based moisture absorber for low outgassing and high reliability in hermetic packages.
Learn moreSTAYCHIP® F614-3A
A thermosetting adhesive with electrical insulation, designed for bonding and sealing semiconductor packages.
Learn moreALPHA® Argomax® 2010C Paste
Sintering paste for die attachment, ideal for high-volume, low-pressure use. Ensures uniform printing and long stencil life.
Learn moreALPHA® Argomax® 2047 Paste
Nano-silver paste for large-area attachments (module to baseplate, heat sink) with a thick, reliable bond line.
Learn moreALPHA® Argomax® 5040 Paste
Sinter silver paste for die attachment on copper, designed for wet paste placement and low-pressure sintering.
Learn moreALPHA® Argomax® 8021 Film
Sinter silver film for die and spacer lamination on various surfaces with pick-and-place, no printing needed.
Learn moreScreen Cleaner A7X
A premium, non-emulsifiable screen cleaner for universal ink removal after printing. Suitable for automatic and manual cleaning.
Learn moreScreen Cleaner K3X
A highly versatile, non-emulsifying screen cleaner providing screen printers with a fast-evaporating product for manual press cleaning.
Learn moreElectrolube® ER2223 High Chemical Epoxy Potting Compound
Highly chemical-resistant epoxy potting compound formulated for harsh conditions in under-hood applications.
Learn moreElectrolube® SC4004 Thixotropic Silicone Resin
Enhanced flow properties aid potting of tight units and delicate electronics with effective heat dissipation and thermal performance.
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