961 results
MICROFAB® SC-32
Acid copper plating process offers excellent throwing power, improved leveling characteristics, and ductile, low-stress deposits.
Learn moreMICROFAB® SC-40
High-speed copper plating process enables flat bump shape, engineered for high-speed pillar, copper stud, and UBM applications.
Learn moreMICROFAB® SC-50
High-speed copper plating process delivers accurate bump height uniformity and bump shape control.
Learn moreNOVAFAB® AG-340
Cyanide-free electroplating process designed to deliver superior deposits for wafer plating applications.
Learn moreNOVAFAB® Pd Acid Strike
Pure palladium acid pre-plate delivers thin Pd deposits for a wide range of current densities and electroplating conditions.
Learn moreMICROFAB® AU3151
Mild alkaline non-cyanide high-purity hardness gold electroplating process with proven reliability and bondability.
Learn moreMICROFAB® AU100 CT DEPLATE
Non-cyanide gold seed deplate reduces costs by selectively stripping gold seed metallization.
Learn morePalladex PC-1 Palladium Cobalt
Electroplating process for Palladium Cobalt alloy delivers exceptional durability and corrosion resistance.
Learn moreBDT-510
Trusted alkaline non-cyanide electroplating system known for its bright appearance and ease of use.
Learn moreMICROFAB® AU310-T
Gold electroplating process provides an arsenic-free bright plating solution with superior surface roughness for fine pitch bumping.
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