MICROFAB® CU1000

High-speed copper plating process for copper pillars in flip chip packages, microbumps in 3D interconnects, and RDL.

Contact Us

Product Overview

The MICROFAB CU1000 process is engineered for high-speed bump and pillar applications. The process delivers accurate bump height uniformity and bump shape control. The product is formulated, packaged, and quality controlled according to the needs of the semiconductor industry.

Related Products

Damascene

Enable advanced-node manufacturing with dual-damascene processes for bottom-up copper electroplating and void-free metallization.

Learn More

Hybrid Bonding

Optimize pitch reduction, power efficiency, and reliability in advanced interconnect applications with our hybrid bonding solutions.

Learn More

Low Alpha Materials

Enhance reliability in next-generation devices with our high-quality, sustainably sourced low-alpha tin materials.

Learn More

Redistribution Layer (RDL)

Unlock best-in-class RDL performance with our RDL solutions, enabling efficient I/O pitch redistribution and advanced plating precision.

Learn More

Through-Silicon Via (TSV)

Fill TSVs efficiently with our copper plating process, delivering reliable bottom-up plating for complex, high-density packages.

Learn More

Wafer Bumping

Enhance reliability and performance in next-generation semiconductor packages with advanced wafer bumping metallization solutions.

Learn More

Related Solutions

Interconnect

We ensure robust and reliable connectivity with our advanced interconnect solutions.

Learn More