25 results
MICROFAB® RDLV Series
Acid copper plating system designed for simultaneous plating of RDL lines and via filling across a wide range of geometries.
Learn moreMICROFAB® DVF-200
Acid copper plating process fills Through-Silicon Vias (TSVs) without voids or defects at high plating speeds.
Learn moreMICROFAB® CU1000
High-speed copper plating process for copper pillars in flip chip packages, microbumps in 3D interconnects, and RDL.
Learn moreMICROFAB® CUMSA100
High-purity electroplating process produces equiaxed-grained matte copper deposits for bump/pillar fabrication.
Learn moreMICROFAB® GSW-100
Acid copper plating process engineered to produce low-stress, pure copper deposits.
Learn moreMICROFAB® GSW-200
Unique acid copper plating system designed for filling blind vias across various geometries.
Learn moreMICROFAB® MP-2500
High-speed copper plating process provides exceptional Within-Die and Within-Feature uniformity for mega pillar applications.
Learn moreNickel Solutions
Nickel sulfamate processes, including boric acid-free options, produce pure, ductile, fine-grained, matte, low-stress deposits.
Learn moreNickel Alloys
MICROFAB® NiFe 1000 and NOVAFAB® NiFe 2000 electrolytic nickel/iron alloy plating processes, designed for MEMs and WLP applications.
Learn moreMICROFAB® Pure BP
Pure copper process with high KV resistance, engineered for copper pillar, copper stud and Under-Bump Metallization (UBM) applications.
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