Nickel Alloys
MICROFAB® NiFe 1000 and NOVAFAB® NiFe 2000 electrolytic nickel/iron alloy plating processes, designed for MEMs and WLP applications.
Contact UsProduct Overview
MICROFAB NiFe 1000 and NOVAFAB NiFe 2000 are innovative electrolytic nickel/iron alloy plating processes for Micro-Electromechanical Systems (MEMS) and barrier applications. Our processes deliver bright, smooth, and uniform deposits.
Product Features
Bright and Smooth Deposit
MICROFAB NiFe 1000 produces a uniform and bright finish with an 80% nickel and 20% iron deposit.
Increased Reliability
NOVAFAB NiFe 2000 produces a 40% nickel and 60% iron deposit for barrier applications, reducing Intermetallic Compound (IMC) growth and improving reliability in advanced devices.
NOVAFAB NiFe 2000
NOVAFAB NiFe 2000 is a plating process for depositing a nickel-iron alloy. The resulting alloy coating is semi-bright, uniform, and ductile. Our testing has confirmed its compatibility with standard wafer plating equipment, ensuring reliable performance.
MICROFAB NiFe 1000
MICROFAB NiFe 1000 is an electrolytic nickel/iron alloy plating process for Micro-Electromechanical Systems (MEMS) and wafer level packaging applications, offering a stable alloy composition. The process delivers bright, smooth, and uniform deposits.
Featured Applications
MEMs and WLP
MICROFAB NiFe 1000 is designed for Micro-Electromechanical Systems (MEMS) and wafer level packaging applications.
Barrier
NOVAFAB NiFe 2000 is an innovative nickel/iron alloy plating process specially designed for barrier applications.
Product Documentation
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