MICROFAB® DVF-200
Acid copper plating process fills Through-Silicon Vias (TSVs) without voids or defects at high plating speeds.
Contact UsProduct Overview
MICROFAB DVF-200 is an acid copper plating process designed to fill TSVs without voids or other defects at high plating speeds. The process is specially formulated for vias with diameters ranging from 5 to 100 μm and aspect ratios of less than 10:1.
Product Features
Reduced Voids and Defects
MICROFAB DVF-200 delivers exceptional bottom-up fill for Through-Silicon Vias.
Versatile Solution
MICROFAB DVF-200 is a versatile solution that exhibits ease of use for a variety of aspect ratios.
Copper Electroplating Process
MICROFAB DVF-200 excels at bottom-up fill and versatility. Designed for a variety of aspect ratios in TSV and interposer applications, this solution can be used in combination with our RDLV Series and Nanotwin Cu systems.
Featured Applications
Through-Silicon Vias (TSV)
MICROFAB DVF-200 is designed to accommodate a variety of aspect ratios for TSV and interposer applications.
Product Documentation
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