MICROFAB® Pure BP
Pure copper process with high KV resistance, engineered for copper pillar, copper stud and Under-Bump Metallization (UBM) applications.
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MICROFAB Pure BP is a high-Kirkendall Void (KV) resistance pure copper process designed for copper pillars without requiring a Ni barrier between the pillar and solder cap. It offers exceptional uniformity within-die and within-feature, along with high purity.