MICROFAB® RDLV Series
Acid copper plating system designed for simultaneous plating of RDL lines and via filling across a wide range of geometries.
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The MICROFAB RDLV 50, 60, and 70 processes are acid copper plating systems designed for simultaneous plating of Redistribution Layer (RDL) lines and filling of vias across a wide range of line, space, and via dimensions. These products are formulated to achieve bottom-up via filling while maintaining a flat line profile with excellent uniformity.