MICROFAB® MP-2500
High-speed copper plating process provides exceptional Within-Die and Within-Feature uniformity for mega pillar applications.
Contact UsProduct Overview
MICROFAB MP-2500 is a high-speed copper plating process engineered for mega pillar applications, delivering exceptional Within-Die (WID) and Within-Feature (WIF, TIR) uniformity.
Product Features
Excellent Uniformity for Thermal Pillar Applications
MICROFAB MP-2500 achieves high-speed plating rates, delivering high-purity bumps with excellent coplanarity for enhanced reliability.
Increased Throughput and Yields
MICROFAB MP-2500 enables high throughput, a flat bump shape, and low Kirkendall Void (KV) capability.
Enhanced Performance and Reliability
MICROFAB MP-2500 enables interconnection for 2.5D and 3D wafer level fan-out and PoP technologies, ensuring thermal management for high performance and reliability.
Featured Applications
Mega Pillar
Smaller form factors and integration technologies are driving the demand for highly co-planar and flat features to achieve high reliability and yield.
Product Documentation
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