9 results
MacuSpec™ VF-TH 500
High-performance, simultaneous via filling and through hole plating acid copper metallization process for high density interconnects.
Learn moreMacuSpec™ HT 200
Direct Current (DC) acid copper plating system that delivers High-Throwing (HT) power for high aspect ratio through holes.
Learn moreMacuSpec™ HT 300
Advanced DC acid copper plating system that provides pulse-like performance for thicker mid-range through-hole metallization.
Learn moreMacuSpec™ HT 360
State-of-the-art DC acid copper plating process that enables high-throw, high-volume production with no need for pulse plating.
Learn moreMacuSpec™ PPR 100 & 200
Pulse plating processes that enable precise thickness uniformity, reliable thermal cycle performance, and superior throwing power.
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MacuSpec™ MPR 100
Cost-effective periodic pulse reverse process that provides higher throwing power, reduced surface copper, and increased plating rates.
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MacuSpec™ VF Series
Via filling copper metallization solutions that provide the most stable and consistent via filling available on the market today.
Learn moreMacuSpec™ AVF Series
Advanced via fill copper metallization processes for high-density interconnects.
Learn moreMacuSpec™ VF-TH Series
Copper plating baths that can simultaneously fill copper microvias and plate through holes with aspect ratios of up to 8:1.
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