MacuSpec™ VF-TH 500
High-performance, simultaneous via filling and through hole plating acid copper metallization process for high density interconnects.
Contact UsProduct Overview
MacuSpec VF-TH 500 is the latest innovation in the award-winning VF-TH series of plating processes. The technology is designed for High-Density Interconnect (HDI) boards that require simultaneous via filling and through-hole plating with excellent microdistribution for panel plating and modified Semi-Additive Processing (mSAP) pattern plating. This versatile solution enables fabricators to meet stringent reliability and performance requirements for complex, multilayer boards used in next-generation technologies.
Product Features
High Performance Via Filling and Through Hole Plating
The chemistry provides high via filling performance for via sizes up to 200 x 100 µm. Fabricators can expect a reliable deposit and improved throwing power at the knee and through hole.
Enhanced Reliability for Complex, Multilayer Printed Circuit Boards (PCBs)
MacuSpec VF-TH 500 exhibits excellent physical (Passing IPC Class III) and thermal reliability properties in solder dip, IR reflow, and OM test (IPC-TM-650 2.6.8, 2.6.26 and 2.6.27).
Compatible with Primary Metallization Processes
MacuSpec VF-TH 500 is compatible with direct metallization or electroless copper with epitaxial growth across the interface for reliable microvias.
Enabling Advanced Interconnect Technologies
Increasing data-processing rates in high-performance computing, advanced automotive, next-generation networking infrastructure and other markets is driving the demand for reliable, high-density printed circuit board designs. Advanced process techniques such as mSAP are increasingly being deployed for creating these HDI boards with complex features such as stacked microvias. MacuSpec VF-TH 500 is specifically formulated to fill large and small microvias to a flat surface, enabling the most complex, high-density designs.
Achieve Excellent Reliability Performance
MacuSpec VF-TH 500 delivers excellent reliability performance demonstrated in the following reliability test results:
- IPC-TM-650: >45,000 psi Tensile Strength, >20% Elongation
- Solder Shock: 288 °C, 10x cycles
- IST: 500x cycles @ 150 °C
- TCT: 1000x cycles @ 150 °C
- CITC: 500x cycles
- OM Test: IR Reflow 6x cycles, then TCT 500x cycles
Featured Applications
Panel plating and modified Semi-Additive Processing (mSAP) pattern plating
MacuSpec VF-TH 500 is designed to provide highly reliable interconnects for challenging stacked multilayer boards used in next-generation communications, high performance computing and automotive applications.